Product Introduction
HS400 Industrial Grade eMMC is an embedded non-volatile storage solution designed for industrial applications, providing reliable data storage and retrieval.
Product Parameters
|
Capacity |
Continuous write (MB/s) |
Continuous read (MB/s) |
Random write (IOPS) |
Random read (IOPS) |
|
8GB |
Up to 120 |
Up to 220 |
Up to 2800 |
Up to 3100 |
|
16GB |
Up to 120 |
Up to 240 |
Up to 2800 |
Up to 3200 |
|
32GB |
Up to 120 |
Up to 260 |
Up to 3000 |
Up to 3300 |
|
64GB |
Up to 200 |
Up to 260 |
Up to 3000 |
Up to 3600 |
|
128GB |
Up to 200 |
Up to 260 |
Up to 3100 |
Up to 3700 |
|
256GB |
Up to 210 |
Up to 260 |
Up to 3200 |
Up to 3800 |
|
HS400,HS200,DDR52,SDR52 |
High Priority Interrupt (HPI) |
|
Back-end operation, BKOPS control |
Packed CMD, command queue |
|
Cache,Cache Flushing Report,Cache Barrier(Optional) |
Partition, partition type, RPMB, RPMB bandwidth optimization |
|
Discard,Trim,Erase,Sanitize |
Write protection, secure write protection (optional) |
|
Lock/unlock |
Power off power notification (PON), Sleep/Awake |
|
Enhance reliability write operations |
Boot feature,Boot partition |
|
Hardware/software reset |
Configurable drive capability |
|
AP vendor |
AP model P/N |
|
RockChip |
RK3126 |
|
RK3228, RK3228H, RK3229, RK328X |
|
|
RK3308, RK3318, RK3328, RK3326, RK3368, RK3368H, RK3399 |
|
|
RK3566, RK3568, RK3588,RK3506 |
|
|
RK1808 |
|
|
RKPX30 |
|
|
RV1126, RV1109, RV1108, V1107 |
|
|
MTK |
MT8163, MT8167, MT8168, MT8173 |
|
MT8735, MT8735B, MT8735M, MT8765, MT8766, MT8783, MT8788 |
|
|
MT8937 |
|
|
MT6580 |
|
|
MT6735, MT6737, MT6739, MT6753, MT6761, MT6763 |
|
|
Amlogic |
S805 |
|
S905X, S905X2, S905X3, S905W |
|
|
Allwinner |
A20, A33, H6,T3,T536 |
|
Intel |
Cherry Trail |
|
Apollo Lake |
|
|
Celeron N4000 |
|
|
Spreadtrum |
SC7731E, SC9832, SC9863 |
|
Qualcomm |
S801 |
|
Others |
Actions, VIA, InfoTMIC, Realtek, Nvidia, Hisilicon, Msta |
|
Part Number |
Density |
Package size |
Package Type |
|
DYE008GFTI |
8GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE016GFTI |
16GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE032GFTI |
32GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE064GFTI |
64GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE128GFTI |
128GB |
11.50×13.00×1.20(mm) |
PBGA-153-Ball |
|
DYE256GFTI |
256GB |
11.50×13.00×1.20(mm) |
PBGA-153-Ball |
|
DYE008GOHI |
8GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE016GOHI |
16GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE032GOHI |
32GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE064GOHI |
64GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE128GOHI |
128GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE256GOHI |
256GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
Application
Edge AI and IoT
Product Features
High-Speed Storage: Supports HS400 mode for fast transfer, with continuous write up to 210MB/s.
High Durability: Uses industrial-grade flash chips, with erase/write cycles ranging from 20,000 to 100,000.
Data Integrity: Built-in error correction ensures data remains intact during long-term storage.
Shock-Resistant Structure: PBGA package enhances soldering strength, capable of withstanding approximately 1500G instantaneous shock.
Company Advantages & Services
Quality Certification: ISO9001 certified with standardized production.
Quality Testing: Functional, aging, and stability tests conducted.
Technical Support: FAE engineers provide platform support.
Fast Samples: Shipped within 3–5 days upon request.
Stable Stock: Common capacities kept in inventory for quick supply.
Small-Batch Support: Initial small-batch testing available.
Flexible Customization: Capacity and firmware tailored to projects.
Secure Packaging: Anti-static and shock-resistant protection.
Global Shipping: Supports DHL, FedEx, UPS, etc.
After-Sales Service: Ongoing technical support and consultation.
FAQ
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